Typical Projects of Shanghai Pudong Design Center

Technical Reformation Project (FAB8/9/10) of Semiconductor Manufacturing International Corporation (Shanghai)
Responsibility: general consultation, feasibility study report, environment assessment report, project design
Project content: 8 inch 0.18 micron IC wafer
Product capacity: 90000 WOPM
Construction area: 120000 m2
Project situation: put into production

8 Inch IC Wafer Factory Project (AT2) of Chengdu Chengxin Semiconductor Manufacturing Co., Ltd.
Responsibility: general consultation, feasibility study report, environment assessment report, project design
Project content: 8 inch and above IC assembly and test production line and wafer production factory
Project occupying area: 93700 m2
Project situation: put into production

8 Inch IC Wafer Factory Project (FAB11) of Chengdu Chengxin Semiconductor Manufacturing Co., Ltd.
Responsibility: general consultation, feasibility study report, environment assessment report, project design
Project content: 8 inch 0.25 micron IC wafer
Product capacity: 22000 WOPM for Phase 1, 55000 WOPM for expecting plan
Project occupying area: 111065 m2
Project situation: under construction

12 Inch IC Production Line Project of Wuhan Xinxin IC Manufacturing Co., Ltd.
Responsibility: general consultation, feasibility study report, environment assessment report, project design
Project content: 12 inch 90nm, 15000 WOPM
Project occupying area: 109507 m2
Project situation: under construction

8 Inch IC Wafer Manufacturing Co., Ltd. of Nantong Green Mountain IC Co., Ltd.
Responsibility: general consultation, feasibility study report, environment assessment report, project design
Project content: 8 inch 200mm, 30000 WOPM
Project situation: under construction

Shanhai IC Research & Development Center Co., Ltd.
Open IC Pilot Production Line Construction Project
Responsibility: feasibility study report, environment assessment report, project design
Project content: 200mm and 300mm open IC pilot production line, be capable of research and test to 65nm IC and production line's transfer 
Project occupying area: 30495 m2
Project situation: under construction

Shanghai Huahong NEC Electronics Co., Ltd.
High-power MOS IC Production Line Expansion Project
Responsibility: feasibility study report, environment assessment report, project design
Project content: 8 inch 0.25 micron IC wafer

Product capability: 25000 WOPM
Project occupying area: 3575 m2
Project situation: under construction

Amkor Assembly & Test (Shanghai) Co., Ltd. project
Responsibility: feasibility study report, environment assessment report, project design
Project content: semiconductor devices
Project occupying area: 47600 m2

Project construction area: 85906 m2
Project situation: under construction

Shanghai Lixin IC Manufacturing Co., Ltd.
8 Inch 0.25 Micron IC Manufacturing Project

Responsibility: EPC
Project occupying area: 232815 m2

Product capacity: 8 inch 0.25 micron IC wafer

Project construction area: 192900 m2
Project situation: under construction of Phase 1

Phase 1 Project of Shaoxing National Swarmped Land Park

Project content: National Swarmped Land Park
Project occupying area: 15 km2 for planning, 300000 m2 for Phase 1
Project situation: completion of Phase 1

Manpower Swamped Land Project of Jinshan Chemical Zone
Project content: 25,000 m3 for daily waste water transportation and treatment volume and 9,125,000 m3 for annual volume
Project occupying area: 330000 km2 for planning
Project situation: completion of Phase 1